- Epitaxial planar die construction - Surface device type mounting - Moisture sensitivity level 1 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Packing code wi.

Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemn.

Multiple manufacture source Multiple manufacture source Green compound Defined manufacture source Green compound Defined manufacture source Green compound Document Number: DS_S1409009 Version: G14 Small Signal Product PACKAGE OUTLINE DIMENSIONS SU.

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